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Comparison ledger

200 SpinversusGamma Spray

CEE 200 Spin, SUSS MicroTec Gamma Spray, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
Gamma SpraySUSS MicroTec
OEMCEESUSS MicroTec
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200SUSS MicroTec GAMMA
Specifications
Phase1 Phase[1]—
TypeSpin Coater[1]—
Model200[1]Gamma[4]
MakeCEE[1]SUSS[4]
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]Spray coater modules (2)[3]
Equipment typeSpin Coater[1]Spray coater[4]
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
Listed contents—Spray coater modules (2), developer (1), power supply, auxiliary parts[3]
Family—Gamma family[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com