Waferpedia

Comparison ledger

200 Spinversus8626

CEE 200 Spin, SVG 8626, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
8626SVG
OEMCEESVG
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200SVG 8626
Specifications
Phase1 Phase[1]—
TypeSpin Coater[1]—
Model200[1]8626[3]
MakeCEE[1]—
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]Cassette to cassette[3]
Equipment typeSpin Coater[1]—
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
OEM—SVG[3]
Wafer size—6 inch[3]
Coat stages—2 coat[3]
Excludes—Pumps[3]
Process—2 coat[3]
Includes—Excludes pumps[3]
Facility equipment listing—SVG 8626 6" Lift-Off resist and BARC Coat Track[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]inventory listing
  4. [4]nanolab.berkeley.edunanolab.berkeley.edu