Waferpedia

Comparison ledger

200 SpinversusAct 8

CEE 200 Spin, Tokyo Electron Act 8, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
Act 8Tokyo Electron
OEMCEETokyo Electron
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200Tokyo Electron Act
Cited variants—
  • Act 8 Coater / Developer - Dual Block, 4 Load Port/1 Side Port - 4 Coaters - 3 Developers - 1 TCT - 14 PHP Hot Plates[1]
  • Act 8 Coater / Developer, 8" - Single[2]
  • Act 8 Coater / Developer, 8"[3]
  • Tel Act 8 Coater / Developer, 8" - Single[2]
  • Tel Act 8 Coater / Developer - Dual Block, 4 Load Port/1 Side Port - 4 Coaters - 3 Developers - 1 TCT - 14 PHP Hot Plates[1]
  • Tel Act 8 Coater / Developer, 8"[3]
Specifications
Phase1 Phase[4]—
TypeSpin Coater[4]—
Model200[4]—
MakeCEE[4]—
Wafer Sizes8 inch[4]—
Configuration1 Phase[4]Dual Block, 4 Load Port/1 Side Port[1]
Equipment typeSpin Coater[4]—
Spin speed5000 rpm[5]—
Substrate supportFlat substrates up to 200 mm or fragments[5]—
Substrate thickness max12 mm[5]—
Coating thicknessUniform coating thickness up to 100 µm[5]—
Vintage—2006
Coaters & Developers Vintage—1999
Wafer Size—8 inch[8]
Known issues—Not included: T&H
Process—COAT / DEV
Software Version—1.18.002
CIM—SECS OEM Model Description

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Sources (8)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]amolf.nlamolf.nl
  6. [6]inventory listing
  7. [7]inventory listing
  8. [8]Equipment inventory listing