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Comparison ledger

200 SpinversusCertas Leaga RST Process

CEE 200 Spin, Tokyo Electron Certas Leaga RST Process, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMCEETokyo Electron
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 200Tokyo Electron Certas Leaga RST Process
Specifications
Phase1 Phase[1]—
TypeSpin Coater[1]—
Model200[1]Certas Leaga RST[4]
MakeCEE[1]—
Wafer Sizes8 inch[1]—
Configuration1 Phase[1]—
Equipment typeSpin Coater[1]Process Chamber[4]
Spin speed5000 rpm[2]—
Substrate supportFlat substrates up to 200 mm or fragments[2]—
Substrate thickness max12 mm[2]—
Coating thicknessUniform coating thickness up to 100 µm[2]—
OEM—Tokyo Electron[3]
Category—Resist Processing[3]
Wafer size—12 inch[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]amolf.nlamolf.nl
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing