Comparison ledger
Chroma IX 210 ChromaDice Laser Dicing, Disco 321, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | |
|---|---|---|
| OEM | Chroma | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Chroma IX 210 ChromaDice Laser Dicing | Disco 321 |
| Specifications | ||
| OEM | — | Disco[1] |
| Model | — | 321[1] |
| Equipment type | — | Wafer Dicing Saw[1] |
| Facility context | — | Cleanroom Instrumentation[1] |
| Application area | — | Nano and Micro Fabrication[1] |
| Location | — | FNT 4.106[1] |
| Wafer Size | — | Up to 6 inches[2] |
| Spindle Power | — | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] |
| Spindle Power (alternate) | — | 1500 Watt spindle[2] |
| Non-Contact Setup | — | Non Contact Setup[3] |
| Microscope | — | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] |
| Broken Blade Detection | — | Broken Blade Detection[3] |
| Light Tower | — | Includes Light Tower[3] |
| Chuck Type | — | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] |
| Wafer size capability | — | Up to 6" wafers[3] |
| Chuck | — | 6-inch porous film frame chuck[2] |
| Spindle power | — | 1500-watt spindle[2] |
| Footprint | — | Small footprint[2] |
| Setup | — | Non-contact setup[3] |
| Blade break detection | — | Broken blade detection[3] |
| Other features | — | Floppy drive, light tower, blade tools, manuals[3] |
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