Chroma
IX 210 ChromaDice Laser Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Chroma IX 210 ChromaDice Laser Dicing Machine is a semiconductor dicing machine.[1]
How it works
General reference — not yet source-verifiedLaser dicing systems use a focused laser beam to cut or weaken material along predefined scribe or dicing lines so the wafer can be divided into individual chips with controlled placement.
This class of equipment is built around precision motion control, optical delivery of the laser, and alignment systems that position the wafer accurately before separation.
Where it fits in the process flow
General reference — not yet source-verifiedThe machine sits near the end of wafer processing, after circuits and back-end preparation steps have been completed and before individual dies move to later assembly operations.
Dicing is typically followed by die handling, attachment, and packaging steps in the semiconductor assembly flow.
Applications
General reference — not yet source-verifiedLaser dicing equipment is used for semiconductor wafer singulation and related die-separation work in microelectronics manufacturing.
It is applicable to wafer-based devices that require precise separation into individual chips while preserving die quality and edge integrity.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
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Not publicly documented
Field notes
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Frequently asked questions
Not publicly documented
The following facts about the IX 210 ChromaDice Laser Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the IX 210 ChromaDice Laser Dicing are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IX 210 ChromaDice Laser Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the IX 210 ChromaDice Laser Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the IX 210 ChromaDice Laser Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IX 210 ChromaDice Laser Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Jul 29, 2026.
