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Comparison ledger

03 iX AutomaticversusUP 2000 HIE

Dek 03 iX Automatic, Speedline UP 2000 HIE, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
UP 2000 HIESpeedline
OEMDekSpeedline
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDek 03 iX AutomaticSpeedline UP 2000 HIE
Specifications
Vintage2020[1]—
Print Area—18" x 16" (457 x 406 mm)[2]
Alignment Accuracy—+/- 0.001" at 6 sigma[2]
Cycle Time—< 11 seconds[2]
Vision System—Advanced vision algorithms for fast fiducial processing[2]
Self-leveling print head—Yes[2]
Closed-loop squeegee pressure control—Available as option[2]
Automatic support pin placement system—Available as option[2]
Full environmental control—Available as option[2]
Equipment type—Solder paste machine[3]
Category—Assembly / SMT[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]goppm.comgoppm.com
  3. [3]Equipment inventory listing
  4. [4]waferpedia.comwaferpedia.com