Speedline
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The Speedline UP 2000 HIE is a solder paste machine. The Speedline UP 2000 HIE is categorized for Assembly / SMT. The Speedline UP 2000 HIE has a print area of 18 in x 16 in (457 x 406 mm).[1][2]
Solder paste printers in SMT assembly deposit paste onto a board through a stencil before component placement. Solder paste printing is an early assembly step that prepares pads for later reflow and joint formation.
The Speedline UP 2000 HIE uses advanced vision algorithms that process fiducials on-the-move to capture images efficiently. The Speedline UP 2000 HIE has a self-leveling print head that allows independent adjustment of squeegee pressure, print speed, and down stop for front and rear squeegee blades. The Speedline UP 2000 HIE uses closed-loop squeegee pressure control to maintain consistent paste deposition. The Speedline UP 2000 HIE has vacuum available as an option. The Speedline UP 2000 HIE has full environmental control available as an option. The Speedline UP 2000 HIE has an automatic support pin placement system available as an option.[2]
In SMT production, solder paste printing is performed before pick-and-place assembly. Printed boards then proceed to component placement and later to reflow soldering.
The Speedline UP 2000 HIE has a print area of 18 inches by 16 inches, or 457 millimeters by 406 millimeters. The Speedline UP 2000 HIE has a cycle time of less than 11 seconds. The Speedline UP 2000 HIE has alignment accuracy of plus or minus 0.001 inch at 6 sigma.[2]
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The Speedline UP 2000 HIE has a print area of 18 inches by 16 inches, or 457 millimeters by 406 millimeters.[2]
The Speedline UP 2000 HIE has a cycle time of less than 11 seconds.[2]
The Speedline UP 2000 HIE has alignment accuracy of plus or minus 0.001 inch at 6 sigma.[2]
The following facts about the UP 2000 HIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UP 2000 HIE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UP 2000 HIE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UP 2000 HIE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UP 2000 HIE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UP 2000 HIE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 19, 2026.
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