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Speedline

UP 2000 HIE

Assembly / SMTSpeedline UP 2000 HIE family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Speedline UP 2000 HIE is a solder paste machine. The Speedline UP 2000 HIE is categorized for Assembly / SMT. The Speedline UP 2000 HIE has a print area of 18 in x 16 in (457 x 406 mm).[1][2]

SpeedlineUP 2000 HIE
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Vacuum

Available as option[3]

Performance

+/- 0.001" at 6 sigma[3]

What it is

General reference — not yet source-verified

Solder paste printers in SMT assembly deposit paste onto a board through a stencil before component placement. Solder paste printing is an early assembly step that prepares pads for later reflow and joint formation.

How it works

The Speedline UP 2000 HIE uses advanced vision algorithms that process fiducials on-the-move to capture images efficiently. The Speedline UP 2000 HIE has a self-leveling print head that allows independent adjustment of squeegee pressure, print speed, and down stop for front and rear squeegee blades. The Speedline UP 2000 HIE uses closed-loop squeegee pressure control to maintain consistent paste deposition. The Speedline UP 2000 HIE has vacuum available as an option. The Speedline UP 2000 HIE has full environmental control available as an option. The Speedline UP 2000 HIE has an automatic support pin placement system available as an option.[2]

Where it fits in the process flow

General reference — not yet source-verified

In SMT production, solder paste printing is performed before pick-and-place assembly. Printed boards then proceed to component placement and later to reflow soldering.

Applications

The Speedline UP 2000 HIE has a print area of 18 inches by 16 inches, or 457 millimeters by 406 millimeters. The Speedline UP 2000 HIE has a cycle time of less than 11 seconds. The Speedline UP 2000 HIE has alignment accuracy of plus or minus 0.001 inch at 6 sigma.[2]

What do the numbers mean?

Vacuum & pumping1

Closed-loop squeegee pressure control
Available as option[3]
Accurate?

Performance1

Alignment Accuracy
+/- 0.001" at 6 sigma[3]
Accurate?

Control & software1

Full environmental control
Available as option[3]
Accurate?

Configuration & options7

Print Area
18" x 16" (457 x 406 mm)[3]2 sources
Accurate?
Cycle Time
< 11 seconds[3]2 sources
Accurate?
Vision System
Advanced vision algorithms for fast fiducial processing[3]
Accurate?
Self-leveling print head
Yes[3]
Accurate?
Automatic support pin placement system
Available as option[3]
Accurate?
Equipment type
Solder paste machine[1]
Accurate?
Category
Assembly / SMT[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Closed-loop squeegee pressure controlAvailable as option[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the print area of the Speedline UP 2000 HIE?

The Speedline UP 2000 HIE has a print area of 18 inches by 16 inches, or 457 millimeters by 406 millimeters.[2]

What is the cycle time of the Speedline UP 2000 HIE?

The Speedline UP 2000 HIE has a cycle time of less than 11 seconds.[2]

What alignment accuracy is given for the Speedline UP 2000 HIE?

The Speedline UP 2000 HIE has alignment accuracy of plus or minus 0.001 inch at 6 sigma.[2]

Not publicly documented

The following facts about the UP 2000 HIE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UP 2000 HIE are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the UP 2000 HIE are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the UP 2000 HIE are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the UP 2000 HIE are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the UP 2000 HIE is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]goppm.com — goppm.comgoppm.com
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Last updated Oct 19, 2026.

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