Comparison ledger
DEK 248 and DEK 2Di, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 248DEK | 2DiDEK |
|---|---|---|
| OEM | DEK | DEK |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | DEK 248 | DEK 2Di |
| Cited variants |
| — |
| Specifications | ||
| Print area | 432 mm x 405 mm (17 in x 15.9 in) max[2] | — |
| Maximum board size | 500 mm x 450 mm (19.5 in x 17.5 in) max[2] | — |
| Machine accuracy | ±25 µm @ 3 sigma[2] | — |
| Machine repeatability | ±10 µm @ 3 sigma[2] | — |
| Machine capability | 0.3 mm pitch QFP 0402 chip packages using vision alignment[2] | — |
| Vision alignment tools | DEKalign 4[2] | — |
| Machine interface | Stand alone[2] | — |
| Power supply | 220 V or 110 V single phase[2] | — |
| Power consumption | Less than 1 kW[2] | — |
| Air supply | Minimum pressure 4 bar (60 psi), clean and dry[2] | — |
| Vacuum supply | Internal vacuum ejector[2] | — |
| Approximate weight | 480 kg (1,056 lbs)[2] | — |
| Approximate dimensions | 1200 mm (W) x 1130 mm (D) x 1140 mm (H) nominal[2] | — |
| Screen frame size | 508 mm x 508 mm (20 in x 20 in) internal[2] | — |
| Operator interface | Machine: easy-touch LCD control console with backlight; Vision: trackball mouse operated[2] | — |
| Operational modes | Double squeegee print/print, print/flood, flood/print[2] | — |
| Print speed | 10-70 mm (0.4-2.7 in)/sec; standard independent forward and reverse speed settings in 1 mm (0.04)/sec increments[2] | — |
| Menu storage | 30 alphanumeric[2] | — |
| Board filename length | 12 characters maximum[2] | — |
| Language options | English, German, French[2] | — |
| inspection type | — | built-in 2-dimensional inspection system[3] |
| stencil inspection | — | detects blocked apertures and underside smearing[3] |
| board inspection | — | verifies correct paste location, alignment, and bridge detection[3] |
| camera system | — | coaxial look-up/look-down camera system[3] |
| lighting | — | advanced lighting with flat lighting, direct and indirect light, and an illuminated annular ring[3] |
| optics | — | telecentric lenses[3] |
| repeatability | — | 3-sigma repeatability[3] |
| board inspection repeatability | — | better than 5% 3-sigma repeatability in tests carried out by DEK[3] |
| processing time | — | 0.2 s per site[3] |
| inspection mode | — | OnePre mode captures a single pre-image of the first board for subsequent paste measurement cycles[3] |
| automation | — | selectable-mode automatic stencil cleaning cycle and alert mode[3] |
Plan your fab
Building a Assembly / SMT process? Get a complete equipment list.
Open the fab equipment planner →