DEK
2Di
The DEK 2Di is a built-in 2-dimensional inspection system for DEK screen printers. The DEK 2Di is used for stencil inspection and board inspection after printing. The DEK 2Di uses a coaxial look-up/look-down camera system.[1][2][3]
What it is
How it works
The DEK 2Di monitors the print process by inspecting selected areas on the board or the stencil, called inspection sites. The DEK 2Di captures an image before printing and compares that image with subsequent images after products are printed. The DEK 2Di can automatically initiate a stencil clean cycle or indicate when more paste should be applied, depending on system programming. The DEK 2Di supports licensing levels that include board inspection for paste on pad and stencil inspection for blockage at a basic level, and bridging, smear, alignment, and volume functions at an advanced level.[3]
The DEK 2Di includes stencil inspection to detect blocked apertures and underside smearing when predefined process limits are reached. The DEK 2Di also inspects the printed board to verify correct paste location, alignment, and bridge detection. The DEK vision architecture uses a coaxial look-up/look-down camera system for simultaneous image capture from the stencil and board. The DEK vision architecture uses telecentric lenses and flat lighting to compensate for board warping and variations in surface finish.[1][2]
Where it fits in the process flow
The DEK 2Di operates within the screen-printing step of a surface-mount assembly line. The DEK 2Di isolates boards with out-of-limit faults so they can be withdrawn from downstream processes. The DEK 2Di uses stencil and board inspection data to help determine whether paste should be refreshed, the stencil should be cleaned, or board alignment should be verified.[1]
Applications
The DEK 2Di is used for stencil inspection, board inspection after print, paste deposit verification, bridge detection, paste volume prediction, and process control in surface-mount manufacturing. The DEK 2Di addresses aperture blockage, paste on the underside of the stencil, paste present on pads, paste alignment on pads, and paste bridging between pads.[2][1]
- stencil inspection
- board inspection after print
- paste deposit verification
- bridge detection
- paste volume prediction
- process control
What do the numbers mean?
Optics & imaging3
- lighting
- advanced lighting with flat lighting, direct and indirect light, and an illuminated annular ring[1]2 sources
Performance3
Dimensions & facilities1
Configuration & options5
- inspection mode
- OnePre mode captures a single pre-image of the first board for subsequent paste measurement cycles[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the DEK 2Di used for?
The DEK 2Di is used for stencil inspection and printed-board inspection in DEK screen printers as part of surface-mount screen-printing process control.[1][2]
What defects does the DEK 2Di inspect on the stencil?
The DEK 2Di detects blocked apertures and underside smearing when predefined process limits are reached.[1][2]
What does the DEK 2Di inspect on the printed board?
The DEK 2Di verifies correct paste location, alignment, and bridge detection on the printed board.[1][2]
How does the imaging system capture stencil and board information?
The DEK vision system uses a coaxial look-up/look-down camera system for simultaneous image capture from the stencil and board, which eliminates relative movement between the two images during board positioning.[1][2]
Can the DEK 2Di trigger process actions automatically?
The DEK 2Di can automatically instigate a stencil clean cycle or determine when more paste should be applied, with actions carried out manually or automatically depending on how the system is programmed.[3]
Not publicly documented
The following facts about the 2Di are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2Di are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2Di are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2Di are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2Di are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2Di is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]https://islandsmt.com/wp-content/uploads/2017/02/2DI-Technical-Manual.pdf — islandsmt.comislandsmt.com
Last updated Oct 20, 2026.
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