Comparison ledger
DEK 260 and DEK 288, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 260DEK | 288DEK |
|---|---|---|
| OEM | DEK | DEK |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | Windows NT | — |
| Generation | — | — |
| Family | DEK 260 | DEK 288 |
| Specifications | ||
| OEM | DEK[1] | — |
| Model | 260[1] | — |
| Screen frame external dimensions | 585 x 585 x 38 mm (23" x 23")[1] | — |
| Screen frame internal dimensions | 508 x 508 mm (20" x 20")[1] | — |
| Screen frame status on Vista page | Options[1] | — |
| Screen frame status on Galaxy page | Configurable as Standard[2] | — |
| Minimum board size | — | 50 x 38 mm (2 x 1.5 in.)[3] |
| Maximum board size | — | 510 x 510 mm (20 x 20 in.)[3] |
| Thickness range | — | 0.4 to 6.4 mm (0.016 to 2.5 in.)[3] |
| Transport speed | — | 500 mm/second (19.5 in./second)[3] |
| Alignment repeatability | — | 25 µm repeatability at 6 Sigma[3] |
| Alignment accuracy | — | 25 µm print to pad at 3 Sigma[3] |
| Cycle time | — | 5 seconds + process variables, including fiducial capture and alignment[3] |
| Set-up time | — | Less than 5 minutes[3] |
| Product changeover | — | 2 minutes (approx.)[3] |
| Host communications | — | GEM and SECS II[3] |
| Networking | — | Windows-compatible LAN card[3] |
| Remote diagnostics | — | Modem option[3] |
| SPC | — | On board, serial, remote[3] |
| Approvals | — | CE, EC certificate of conformity (Safety and EMC), GS German trade union safety standard[3] |
| Approximate weight | — | 1500 kg[3] |
| Approximate dimensions | — | 1580 mm W x 1640 mm D x 1680 mm H (nominal)[3] |
| Stencil frame compatibility | — | External dimensions between 550 mm sq. and 850 mm sq.[3] |
| Screen adjustment X/Y range | — | ±10 mm, resolution 2.5 µm[3] |
| Theta range | — | ±2.0°, resolution 0.001°[3] |
| Printable area with clamps | — | 510 x 504 mm (20 x 19.8 in.)[3] |
| Printable area with snuggers | — | 510 x 510 mm (20 x 20 in.)[3] |
| Print stroke | — | 56 to 680 mm (2.2 to 28.8 in.)[3] |
| Print speed | — | 2 to 300 mm/second (0.08 to 12 in./second)[3] |
| Print pressure | — | 0.4 to 20 kg (1 to 44 lbs.) active during print[3] |
| Print gap | — | 0 to 3.0 mm (0 to 0.1 in.)[3] |
| PCB stencil separation speed | — | 0.1 to 20 mm/second (0.004 to 0.8 in./second)[3] |
| Print modes | — | Print/flood double squeegee[3] |
| Squeegee types | — | Accepts most materials and style blades[3] |
| Paste system | — | Option to dispense, 1 kg and 500 g cartridge[3] |
| Paste knead | — | Programmable paste kneading action[3] |
| Stencil cleaning | — | Programmable frequency and wipe combinations; dry, wet, vacuum options[3] |
| Air service | — | 3.5-6 bar[3] |
| Electrics | — | 110 V 32 amps, 220 V 16 amps[3] |
| Temperature cooling unit | — | Cools printhead temperature within the range 17-30°C[3] |
| Environmental control unit | — | Full temperature and humidity control of printhead environment[3] |
| Product bar-code reader | — | Dual Image identified board and product verification[3] |
| Screen bar-code reader | — | Product screen verification[3] |
| On-board SPC software | — | Windows-based software package displaying fiducial offsets, board stretch, front and rear squeegee pressure, print speed, separation speed, temperature and relative humidity; switchable between MMI and QC CALC[3] |
| Fiducial size | — | 0.5 to 3 mm (0.02 to 0.1 in.)[3] |
| Fiducial method | — | 2 and 3 fiducial option[3] |
| Align calibration | — | Fully automatic calibration[3] |
| Camera system | — | On-the-move telecentric XY camera with simultaneous look at stencil and board[3] |
| Stencil inspection | — | Blocked apertures and smearing on underside of stencil triggers under-stencil cleaner[3] |
| Board inspection | — | Paste alignment to pad, bridging, paste area, triggers paste dispense[3] |
| Board size (min/max) | — | 50 x 38 mm (2 x 1.5 in.) up to 510 x 510 mm (20 x 20 in.)[3] |
| Board thickness range | — | 0.4 to 6.4 mm (0.016 to 2.5 in.)[3] |
| Cycle time (incl. fiducial capture & alignment) | — | 5 seconds + process variables[3] |
| Print speed range | — | 2 to 300 mm/second (0.08 to 12 in./second)[3] |
| Print pressure range | — | 0.4 to 20 kg (1 to 44 lbs.) active during print[3] |
| Stencil frame size compatibility | — | frames with external dimensions between 550 mm (21.6 in.) sq. and 850 mm (31.5 in.) sq.[3] |
| Weight (approximate) | — | 1500 kg[3] |
| Dimensions (W x D x H) | — | 1580 mm W x 1640 mm D x 1680 mm H (nominal)[3] |
| Air supply | — | 3.5-6 bar[3] |
| Vision system type | — | On-the-move telecentric XY camera with simultaneous look at stencil and board[3] |
Plan your fab
Building a Assembly / SMT process? Get a complete equipment list.
Open the fab equipment planner →