Comparison ledger
DEK 265GSX/265GS/265 and DEK 2Di, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 2DiDEK | |
|---|---|---|
| OEM | DEK | DEK |
| Category | Assembly / SMT | Assembly / SMT |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | DEK 265GSX/265GS/265 | DEK 2Di |
| Specifications | ||
| Accepted frame designation | DEK 265GSX/265GS/265[1] | — |
| Frame size | 29" x 29" OD[1] | — |
| Adaptor requirement | No adaptor[1] | — |
| inspection type | — | built-in 2-dimensional inspection system[2] |
| stencil inspection | — | detects blocked apertures and underside smearing[2] |
| board inspection | — | verifies correct paste location, alignment, and bridge detection[2] |
| camera system | — | coaxial look-up/look-down camera system[2] |
| lighting | — | advanced lighting with flat lighting, direct and indirect light, and an illuminated annular ring[2] |
| optics | — | telecentric lenses[2] |
| repeatability | — | 3-sigma repeatability[2] |
| board inspection repeatability | — | better than 5% 3-sigma repeatability in tests carried out by DEK[2] |
| processing time | — | 0.2 s per site[2] |
| inspection mode | — | OnePre mode captures a single pre-image of the first board for subsequent paste measurement cycles[2] |
| automation | — | selectable-mode automatic stencil cleaning cycle and alert mode[2] |
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