Waferpedia

Comparison ledger

288versusHorizon 03 i

DEK 288, Dek Horizon 03 i, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Assembly / SMT, null[1]
Side-by-side comparison of selected equipment models
Attribute
288DEK
OEMDEKDek
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDEK 288Dek Horizon 03
Specifications
Minimum board size50 x 38 mm (2 x 1.5 in.)[2]40 x 50mm[1]
Maximum board size510 x 510 mm (20 x 20 in.)[2]510 x 508mm[1]
Thickness range0.4 to 6.4 mm (0.016 to 2.5 in.)[2]—
Transport speed500 mm/second (19.5 in./second)[2]—
Alignment repeatability25 µm repeatability at 6 Sigma[2]—
Alignment accuracy25 µm print to pad at 3 Sigma[2]—
Cycle time5 seconds + process variables, including fiducial capture and alignment[2]—
Set-up timeLess than 5 minutes[2]—
Product changeover2 minutes (approx.)[2]—
Host communicationsGEM and SECS II[2]—
NetworkingWindows-compatible LAN card[2]—
Remote diagnosticsModem option[2]—
SPCOn board, serial, remote[2]—
ApprovalsCE, EC certificate of conformity (Safety and EMC), GS German trade union safety standard[2]—
Approximate weight1500 kg[2]—
Approximate dimensions1580 mm W x 1640 mm D x 1680 mm H (nominal)[2]—
Stencil frame compatibilityExternal dimensions between 550 mm sq. and 850 mm sq.[2]—
Screen adjustment X/Y range±10 mm, resolution 2.5 µm[2]—
Theta range±2.0°, resolution 0.001°[2]—
Printable area with clamps510 x 504 mm (20 x 19.8 in.)[2]—
Printable area with snuggers510 x 510 mm (20 x 20 in.)[2]—
Print stroke56 to 680 mm (2.2 to 28.8 in.)[2]—
Print speed2 to 300 mm/second (0.08 to 12 in./second)[2]—
Print pressure0.4 to 20 kg (1 to 44 lbs.) active during print[2]—
Print gap0 to 3.0 mm (0 to 0.1 in.)[2]—
PCB stencil separation speed0.1 to 20 mm/second (0.004 to 0.8 in./second)[2]—
Print modesPrint/flood double squeegee[2]—
Squeegee typesAccepts most materials and style blades[2]—
Paste systemOption to dispense, 1 kg and 500 g cartridge[2]—
Paste kneadProgrammable paste kneading action[2]—
Stencil cleaningProgrammable frequency and wipe combinations; dry, wet, vacuum options[2]—
Air service3.5-6 bar[2]—
Electrics110 V 32 amps, 220 V 16 amps[2]—
Temperature cooling unitCools printhead temperature within the range 17-30°C[2]—
Environmental control unitFull temperature and humidity control of printhead environment[2]—
Product bar-code readerDual Image identified board and product verification[2]—
Screen bar-code readerProduct screen verification[2]—
On-board SPC softwareWindows-based software package displaying fiducial offsets, board stretch, front and rear squeegee pressure, print speed, separation speed, temperature and relative humidity; switchable between MMI and QC CALC[2]—
Fiducial size0.5 to 3 mm (0.02 to 0.1 in.)[2]—
Fiducial method2 and 3 fiducial option[2]—
Align calibrationFully automatic calibration[2]—
Camera systemOn-the-move telecentric XY camera with simultaneous look at stencil and board[2]—
Stencil inspectionBlocked apertures and smearing on underside of stencil triggers under-stencil cleaner[2]—
Board inspectionPaste alignment to pad, bridging, paste area, triggers paste dispense[2]—
Board size (min/max)50 x 38 mm (2 x 1.5 in.) up to 510 x 510 mm (20 x 20 in.)[2]—
Board thickness range0.4 to 6.4 mm (0.016 to 2.5 in.)[2]—
Cycle time (incl. fiducial capture & alignment)5 seconds + process variables[2]—
Print speed range2 to 300 mm/second (0.08 to 12 in./second)[2]—
Print pressure range0.4 to 20 kg (1 to 44 lbs.) active during print[2]—
Stencil frame size compatibilityframes with external dimensions between 550 mm (21.6 in.) sq. and 850 mm (31.5 in.) sq.[2]—
Weight (approximate)1500 kg[2]—
Dimensions (W x D x H)1580 mm W x 1640 mm D x 1680 mm H (nominal)[2]—
Air supply3.5-6 bar[2]—
Vision system typeOn-the-move telecentric XY camera with simultaneous look at stencil and board[2]—
Configuration—50/60 Hz[3]
Board Minimum Size—40 x 50mm[1]
Board Maximum Size—510 x 508mm[1]
Board Thickness—0.2mm - 6mm[1]
Board Maximum Weight—1Kg[1]
Underside Component Clearance—Up to 8mm including PCB thickness[1]
Print Speed—2mm - 150mm/sec[1]
Print Pressure—0 - 20kg[1]
Print Gap—0 - 6mm, programmable[1]
Stencil Separation Speed—0.1 - 20mm/sec[1]
Stencil Separation Distance—0 - 3mm[1]
Process Capability—1.33 Cpk @ ±25µm Including Process[1]
Alignment Cycle Time—14 secs (12 secs with Speedup)[1]
Product Changeover—2 minutes[1]
New Product Set Up—<10 minutes[1]
Vision System—Cognex[1]
Operating System—Windows XP[1]
Power Supply Voltage—115 volts +/- 10% at 20 amps or 230 volts +/- 10% at 10 amps, single phase 50/60Hz[1]
Air Supply—5 - 8 bar at 5 Litres/min, ISO 8573.1 class 2.3.3[1]
Operating Temperature—10 - 35°C (50 - 95°F)[1]
Operating Humidity—30 - 70% Relative Humidity (non condensing)[1]
Weight—800kg (1760lbs)[1]
Dimensions (L x W x H)—2050mm x 1500mm x 1570mm[1]
Screen Frame Type—DEK 265 (736 x 736 x 38/40mm external, 660 x 660mm internal)[1]
Screen Frame Standard—29" x 29" / 26" x 26"[1]
Stencil Mount Adjustment—Configurable between 29" to 12" in under 2 secs[1]
Transport Conveyor Max Height—3mm - 42mm programmable[1]
Fiducial Size—0.5mm - 3.0mm[1]
Certification—CE (98/37/EC, 89/336/EEC, 73/23/EEC, 2003/10/EC)[1]
Equipment type—Screen printer[4]
Make—Dek[4]
Model—Horizon 03 i[4]
Vintage—2009[3]
Power—50/60 Hz - 230 Volt[3]
Screen frame standard—DEK 265[1]
External screen frame size—736 x 736 x 38/40mm[1]
Internal screen frame size—660 x 660mm (26" x 26")[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]inventory listing
  4. [4]Equipment inventory listing