Comparison ledger
Denton Vacuum 635LL and Denton Vacuum Discovery 18, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 635LLDenton Vacuum | Discovery 18Denton Vacuum |
|---|---|---|
| OEM | Denton Vacuum | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | 200mm | 6-inch diameter stage |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum 635LL | Denton Vacuum Discovery |
| Specifications | ||
| Cathodes | 4-cathodes[1] | Three 3-inch diameter confocal cathodes[2] |
| Gas / process feedback | RGA, OES-feedback reactive oxygen or nitrogen sputter[1] | — |
| Chuck temperature | heated/cooled chuck to 500C[1] | — |
| Process mode | co-sputtering[1] | — |
| Substrate size | coats up to 200mm diameter substrates[1] | — |
| Deposition type | — | Sputter deposition of metals, alloys, and insulating thin films[2] |
| Film thickness range | — | From a few nm to hundreds of nm[2] |
| RF power supplies | — | 2 RF power supplies[2] |
| DC power supply | — | Switchable DC power supply[2] |
| Co-sputter capability | — | Yes[2] |
| Reactive sputtering | — | Available with nitrogen or oxygen[2] |
| Stage diameter | — | 6-inch diameter stage[2] |
| Substrate rotation uniformity | — | +/- 10%[2] |
| Pump system | — | Cryo and turbo pumped[2] |
| Base pressure | — | 1 x 10^7 Torr[2] |
| Substrate heating | — | Up to 200 C[2] |
| Liftoff deposition | — | Available with sputter power[2] |
| Argon pressure range | — | 3-15 mT controllable with 200 sccm MFC controller[2] |
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