Waferpedia

Comparison ledger

Discovery 18 versus EE-4

Denton Vacuum Discovery 18 and Denton Vacuum EE-4, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
Discovery 18Denton Vacuum
EE-4Denton Vacuum
OEMDenton VacuumDenton Vacuum
CategoryDepositionDeposition
Wafer size6-inch diameter stage3"
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDenton Vacuum DiscoveryDenton Vacuum EE-4
Specifications
Deposition typeSputter deposition of metals, alloys, and insulating thin films[1]
Film thickness rangeFrom a few nm to hundreds of nm[1]
CathodesThree 3-inch diameter confocal cathodes[1]
RF power supplies2 RF power supplies[1]
DC power supplySwitchable DC power supply[1]
Co-sputter capabilityYes[1]
Reactive sputteringAvailable with nitrogen or oxygen[1]
Stage diameter6-inch diameter stage[1]
Substrate rotation uniformity+/- 10%[1]
Pump systemCryo and turbo pumped[1]
Base pressure1 x 10^7 Torr[1]
Substrate heatingUp to 200 C[1]
Liftoff depositionAvailable with sputter power[1]
Argon pressure range3-15 mT controllable with 200 sccm MFC controller[1]
OEMDenton Vacuum[2]
ModelEE-4[2]
Tool typeElectron beam deposition tool[2]
Hearth positions6-position hearth[2]
Vacuum environmenton the order of e-7 torr[2]
Chamber designDual chamber design[2]
AutomationDepositions and pump-down/venting sequences are automated using an onboard PLC[2]
Substrate handlingRotating substrate holders[2]
Available materialsAu, Pt, Ag, Ti, Cr, Pd[2]
FacilityNanofabrication Facility[2]
LocationLISE Cleanroom G07[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu