Waferpedia

Comparison ledger

Discovery 18 versus Thermal

Denton Vacuum Discovery 18 and Denton Vacuum Thermal, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
Discovery 18Denton Vacuum
ThermalDenton Vacuum
OEMDenton VacuumDenton Vacuum
CategoryDepositionDeposition
Wafer size6-inch diameter stage
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDenton Vacuum DiscoveryDenton Vacuum Thermal
Specifications
Deposition typeSputter deposition of metals, alloys, and insulating thin films[1]
Film thickness rangeFrom a few nm to hundreds of nm[1]
CathodesThree 3-inch diameter confocal cathodes[1]
RF power supplies2 RF power supplies[1]
DC power supplySwitchable DC power supply[1]
Co-sputter capabilityYes[1]
Reactive sputteringAvailable with nitrogen or oxygen[1]
Stage diameter6-inch diameter stage[1]
Substrate rotation uniformity+/- 10%[1]
Pump systemCryo and turbo pumped[1]
Base pressure1 x 10^7 Torr[1]
Substrate heatingUp to 200 C[1]
Liftoff depositionAvailable with sputter power[1]
Argon pressure range3-15 mT controllable with 200 sccm MFC controller[1]
ConfigurationDiffusion Pump[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]inventory listing