Comparison ledger
Denton Vacuum EE-4 and Denton Vacuum Explorer 14, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | EE-4Denton Vacuum | Explorer 14Denton Vacuum |
|---|---|---|
| OEM | Denton Vacuum | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | 3" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum EE-4 | Denton Vacuum Explorer 14 |
| Specifications | ||
| OEM | Denton Vacuum[1] | — |
| Model | EE-4[1] | — |
| Tool type | Electron beam deposition tool[1] | — |
| Hearth positions | 6-position hearth[1] | — |
| Vacuum environment | on the order of e-7 torr[1] | — |
| Chamber design | Dual chamber design[1] | — |
| Automation | Depositions and pump-down/venting sequences are automated using an onboard PLC[1] | — |
| Substrate handling | Rotating substrate holders[1] | — |
| Available materials | Au, Pt, Ag, Ti, Cr, Pd[1] | — |
| Facility | Nanofabrication Facility[1] | — |
| Location | LISE Cleanroom G07[1] | — |
| Chamber | — | 14"x 14"[2] |
| Configuration | — | 2 RF Cathodes, RF Plasma Clean[2] |
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