Waferpedia

Comparison ledger

EE-4 versus SJ20C

Denton Vacuum EE-4 and Denton Vacuum SJ20C, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
EE-4Denton Vacuum
SJ20CDenton Vacuum
OEMDenton VacuumDenton Vacuum
CategoryDepositionDeposition
Wafer size3"
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDenton Vacuum EE-4Denton Vacuum SJ20C
Specifications
OEMDenton Vacuum[1]
ModelEE-4[1]
Tool typeElectron beam deposition tool[1]
Hearth positions6-position hearth[1]
Vacuum environmenton the order of e-7 torr[1]
Chamber designDual chamber design[1]
AutomationDepositions and pump-down/venting sequences are automated using an onboard PLC[1]
Substrate handlingRotating substrate holders[1]
Available materialsAu, Pt, Ag, Ti, Cr, Pd[1]
FacilityNanofabrication Facility[1]
LocationLISE Cleanroom G07[1]
Tool ownerJim Pierce[2]
Serial number18097[2]
DescriptionFilm thickness monitor/deposition controller[2]
Deposition methodE-beam evaporation[2]
Source hearths4 source hearth[2]
Evaporation materials availableAl, Ag, Au, Au/Ge, Cr, Cu, Ge, Mo, NiCr, Nb, Ni, Ta, Ti, W[2]
Crucible liner typesPoco Graphite crucible liners (large & small); Cu crucible liners[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
  2. [2]nanofab.utah.edunanofab.utah.edu