Comparison ledger
Denton Vacuum EE-4 and Denton Vacuum SJ20C/Material, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | EE-4Denton Vacuum | SJ20C/MaterialDenton Vacuum |
|---|---|---|
| OEM | Denton Vacuum | Denton Vacuum |
| Category | Deposition | Deposition |
| Wafer size | 3" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Denton Vacuum EE-4 | Denton Vacuum SJ20C/Material |
| Specifications | ||
| OEM | Denton Vacuum[1] | — |
| Model | EE-4[1] | — |
| Tool type | Electron beam deposition tool[1] | — |
| Hearth positions | 6-position hearth[1] | — |
| Vacuum environment | on the order of e-7 torr[1] | — |
| Chamber design | Dual chamber design[1] | — |
| Automation | Depositions and pump-down/venting sequences are automated using an onboard PLC[1] | — |
| Substrate handling | Rotating substrate holders[1] | — |
| Available materials | Au, Pt, Ag, Ti, Cr, Pd[1] | — |
| Facility | Nanofabrication Facility[1] | — |
| Location | LISE Cleanroom G07[1] | — |
| Tool owner | — | Jim Pierce[2] |
| Serial number | — | 18097[2] |
| Tool description | — | Film thickness monitor/deposition controller[2] |
| Process | — | E-beam evaporation[2] |
| Evaporation materials available | — | Al, Ag, Au, Au/Ge, Cr, Cu, Ge, Mo, NiCr, Nb, Ni, Ta, Ti, W[2] |
| Crucible liners | — | Poco Graphite crucible liners (large and small); Cu crucible liners[2] |
| SOP | — | Denton SJ20C SOP[2] |
| Process Type | — | E-beam evaporation[2] |
| Deposition Method | — | Physical Vapor Deposition (PVD)[2] |
| Number of Source Hearth Positions | — | 4[2] |
| Film Thickness Monitor/Deposition Controller | — | Present[2] |
| Crucible Liner Types | — | Poco Graphite (large & small), Cu[2] |
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