Comparison ledger
Disco 321 and Disco DAD321, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 321Disco | DAD321Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DAD321 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | — |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Machine type | — | Automatic dicing saw[2] |
| Wafer size | — | 100 mm, 150 mm[2] |
| Supported wafer materials | — | Silicon, glass and pyrex wafers[2] |
| Other materials | — | Other materials on demand[2] |
| Maximum thickness on silicon | — | 1 mm[2] |
| Maximum thickness on glass and pyrex | — | 2.4 mm[2] |
| Max wafer size | — | 6 inches[3] |
| Wafer type | — | All shapes and sizes[3] |
| Max wafer thickness | — | 2 mm[3] |
| Max blade speed | — | 30,000 rpm[3] |
| Max feed speed | — | 2 mm/sec[3] |
| Tape thickness | — | 70 μm[3] |
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