Disco

DAD321

Dicing & Grinding 100mm Disco DAD321 family

Research Quality: 20% complete

DiscoDAD321

No photo available yet

Plate 01Disco DAD321 6" Dicing Saw Video 1
CSI SemiWatch on YouTube
Plate 02Disco DAD321 6" Dicing Saw Video 2
CSI SemiWatch on YouTube
Plate 03DISCO DAD321
Semi Tools GmbHWatch on YouTube
Plate 04DAD321 1
KU Budn2118Watch on YouTube

What is it?

The Disco DAD321 is listed as an automatic dicing saw. The source states that it is used for 100 mm and 150 mm wafers, supports silicon, glass, and pyrex wafers, and can handle other materials on demand. It is located in Zone 22.

What do the numbers mean?

Wafer handling5

Wafer size: 100 mm, 150 mm^[1]
Supported wafer materials: Silicon, glass and pyrex wafers^[1]
Max wafer size: 6 inches^[2]
Wafer type: All shapes and sizes^[2]
Max wafer thickness: 2 mm^[2]

Configuration & options7

Machine type: Automatic dicing saw^[1]
Other materials: Other materials on demand^[1]
Maximum thickness on silicon: 1 mm^[1]
Maximum thickness on glass and pyrex: 2.4 mm^[1]
Max blade speed: 30,000 rpm^[2]
Max feed speed: 2 mm/sec^[2]
Tape thickness: 70 μm^[2]

Interested in this tool?

Embed spec card

What replaced it?

siblingDisco DAD3221— listed on the same source page as another automatic dicing sawsource^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the DAD321 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD321 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD321 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD321 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD321 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD321 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources

[1]epfl.ch — epfl.chepfl.ch
[2]ncf.uic.edu — ncf.uic.eduncf.uic.edu
[3]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch

Was this page accurate?

Last updated Jul 29, 2026.

Compare with similar tools

View all →

APD1Logitech

The Logitech APD1 is a combined annular and peripheral precision saw for slicing wafers, crystals, semiconductor components, and other materials with minimal kerf loss and surface damage.

CategoryDicing & GrindingWafer100mm

14 specs

DAD321 vs APD1 →