Comparison ledger
Disco 321 and Disco DAG810, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 321Disco | DAG810Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DAG810 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | compact, automatic grinder[2] |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Materials | — | silicon, III/V materials (GaN, GaAs, InP), and various glass types (pure amorphous SiO2, float glass, pyrex)[2] |
| Wafer sizes supported by universal vacuum chuck table | — | 4", 5", 6", and 8"[2] |
| Mechanical frame use | — | for UV-tape mounted wafers or chips[2] |
| Spindle | — | high-rigidity, low-vibration spindle[2] |
| Grinding wheels | — | dedicated wheels for coarse and fine silicon grinding, coarse and fine glass grinding, and GaN fine grinding[2] |
| Probe-height | — | real-time probe-height from 4" wafer size[2] |
| User interface | — | LCD touch screen[2] |
| Grinding speed | — | as high as 30 microns/min[2] |
| Thickness variation | — | total thickness variation close to one micron[2] |
| Surface roughness | — | less than 100 nm[2] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →