Disco

DAG810

Dicing & Grinding 4"Disco DAG810 family

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DAG810 — epfl.ch — Fig. 01DAG810epfl.ch^[1]

Plate 01Disco DAG 810 Demo Vid 3
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Plate 02Disco DAG 810 Demo vid 2
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Wafer size

Vacuum

4", 5", 6", and 8"^[1]

Optics

less than 100 nm^[1]

What is it?

The DAG810 is described as a compact, automatic grinder for silicon, III/V materials such as GaN, GaAs, and InP, as well as various glass types. It is used to thin down single wafers, stacked wafers, or chips, and the equipment description states a universal vacuum chuck table for 4" to 8" wafer sizes, dedicated grinding wheels by material, and real-time probe-height from 4" wafer size.

What can it run?

Process applications and technology nodes documented for this tool.

thinning single wafers
thinning stacked wafers
thinning chips
coarse and fine silicon grinding
coarse and fine glass grinding
GaN fine grinding

Why won't it start?

Documented failure modes, common issues, and field considerations.

probe-height is not usable with chips, wafers with topography, and wafers smaller than 4"
ground surfaces are always damaged after grinding
a micro-cracked layer is present after grinding
wafer edges can become sharp during grinding and may induce breakage depending on final thickness

What do the numbers mean?

Vacuum & pumping1

Wafer sizes supported by universal vacuum chuck table: 4", 5", 6", and 8"^[1]

Wafer handling2

Mechanical frame use: for UV-tape mounted wafers or chips^[1]
Probe-height: real-time probe-height from 4" wafer size^[1]

Optics & imaging1

Surface roughness: less than 100 nm^[1]

Control & software1

User interface: LCD touch screen^[1]

Configuration & options6

Equipment type: compact, automatic grinder^[1]
Materials: silicon, III/V materials (GaN, GaAs, InP), and various glass types (pure amorphous SiO2, float glass, pyrex)^[1]
Spindle: high-rigidity, low-vibration spindle^[1]
Grinding wheels: dedicated wheels for coarse and fine silicon grinding, coarse and fine glass grinding, and GaN fine grinding^[1]
Grinding speed: as high as 30 microns/min^[1]
Thickness variation: total thickness variation close to one micron^[1]

Interested in this tool?

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Wafer sizes supported by universal vacuum chuck table4", 5", 6", and 8"^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the DAG810 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAG810 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAG810 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAG810 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the DAG810 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DAG810 are on record.
Answerable by: an OEM parts catalog or a service engineer