Waferpedia

Comparison ledger

321 versus DGP 8761 + DFM 2800 In-Line

Disco 321 and Disco DGP 8761 + DFM 2800 In-Line, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
321Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco 321Disco DGP 8761
Specifications
OEMDisco[1]
Model321[1]
Equipment typeWafer Dicing Saw[1]
Facility contextCleanroom Instrumentation[1]
Application areaNano and Micro Fabrication[1]
LocationFNT 4.106[1]
ConfigurationFully Automatic[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]tmi.utexas.edutmi.utexas.edu
  2. [2]inventory listing