Comparison ledger
Disco 3220, Disco DFG 8540 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | DFG 8540 BackDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DFG |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Configuration | — | 6" / 8" Universal Table for IGBT Si[3] |
| Voltage | — | 200 VAC[3] |
| Phase | — | 3 Phase[3] |
| Full Load | — | 54 A[3] |
| Make | — | Disco[3] |
| Model | — | DFG 8540[3] |
| Equipment type | — | Back Grinder[3] |
| Wafer sizes | — | 6, 8 inch[3] |
| Grinding method | — | Anomalous in-feed grinding with wafer rotation[4] |
| Supported workpiece size | — | Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table use)[4] |
| Grinding wheels | — | Φ200 mm Diamond Wheel[4] |
| Spindle rated output | — | 4.2 kW[4] |
| Rotation speed range | — | 1,000 to 7,000 min-1[4] |
| Equipment dimensions (W × D × H) | — | 1,200 × 2,670 × 1,800 mm[4] |
| Equipment weight | — | Approx. 3,100 kg[4] |
| Processing capability | — | Large diameter grinding and thin-finish grinding[5] |
| Thin wafer handling | — | Ultra-thin wafer handling to 100 µm and less[5] |
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