Comparison ledger
Disco 3220, Disco DFL 7340 Stealth Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DFL 7340 |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Configuration | — | Power supply removed[3] |
| OEM | — | Disco[4] |
| Model | — | DFL7340[4] |
| Process area | — | Packaging[4] |
| Purpose | — | Laser Stealth dicing of Si wafers[5] |
| Applications field | — | Contact-less dicing of Silicon wafers PICs, MEMS, BIO-MEMS and Semiconductor non-wet dicing[5] |
| Wavelength | — | 1342 nm[4] |
| Maximum sample diameter | — | 200 mm[4] |
| Wafer size | — | 200 mm or smaller[5] |
| Compatible materials | — | Si wafers only[4] |
| Dicing orientation | — | Topside or backside (through tape) dicing possible[4] |
| Position accuracy | — | 3 µm[5] |
| Feeding speed | — | 1.0–1000 mm/s[5] |
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