Comparison ledger
Disco 3220 and Disco DFL 7361, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | 3220Disco | DFL 7361Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | Integrated Wafer Cleaning System with Atomizing Nozzle |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DFL |
| Cited variants | — |
|
| Specifications | ||
| equipment type | dicing saw[2] | — |
| Workplace size | ø150 mm[3] | — |
| Spindle layout | Single[3] | — |
| Spindle output | 1.5 kW at 30,000 min-1[3] | — |
| Spindle max revolution speed | 40,000 min-1[3] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[3] | — |
| Y-axis index step | 0.0001 mm[3] | — |
| Z-axis repeating accuracy | 0.001 mm[3] | — |
| Z-axis max blade size | ø58 mm[3] | — |
| Configuration | — | Type FX Laser Head[1] |
| Wafer size | — | Integrated Wafer Cleaning System with Atomizing Nozzle[1] |
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