Waferpedia

Disco

DFL 7361

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The Disco DFL 7361 is a laser saw for stealth dicing of wafers up to 300 mm. The Disco DFL 7361 uses a Type FX Laser Head and BSS-6 Optics System. The Disco DFL 7361 includes an integrated wafer cleaning system with atomizing nozzle.[1]

DFL 7361 — Inventory photo
Fig. 01DFL 7361Inventory photo[1]

Wafer size

Integrated Wafer Cleaning System with Atomizing Nozzle

Power

Uninterruptible Power Supply[1]

Performance

0.003 mm within 310 mm[5]

Optics

Type FX Laser Head[1]

What it is

The Disco DFL 7361 is a laser saw. The Disco DFL 7361 is specified for workpieces from 2 inches to 12 inches. The Disco DFL 7361 uses a Type FX laser head and a BSS-6 optics system. The Disco DFL 7361 has a chuck table that moves in the X and Y directions. The Disco DFL 7361 includes a graphical user interface with a touch screen, a high resolution image processing system with auto focus, a fully automatic frame handling system, an integrated wafer cleaning system with an atomizing nozzle, cassette loading and unloading, and both 12 inch and 8 inch porous chuck table and spinner table configurations.[1][2][6]

How it works

General reference — not yet source-verified

Laser saws direct concentrated laser energy to defined cutting paths on a workpiece. Laser saws rely on motion control, optical focusing, imaging, and alignment to place the beam on the intended streets or cut regions. Laser saws commonly integrate cleaning and handling functions so that processed substrates can be transferred and prepared within the same tool environment.

Where it fits in the process flow

The Disco DFL 7361 includes a fully automatic frame handling system and cassette loading and unloading. The Disco DFL 7361 also includes an independent Hogomax spin coating system and an integrated wafer cleaning system with an atomizing nozzle. The Disco DFL 7361 can be configured with SECS/GEM software and barcode reading for automatic recipe loading.[1][2][6]

Applications

General reference — not yet source-verified

Laser saws are applied where noncontact or subsurface separation methods are preferred for delicate, thin, brittle, or difficult-to-machine substrates. Laser saws are used for singulating semiconductor wafers and related device substrates when controlled energy placement and reduced mechanical loading are important process goals.

What do the numbers mean?

Power & electrical4

Uninterruptible Power Supply[1]
Accurate?
Power conditioning
Overseas Transformer Unit; Uninterruptible Power Supply[1]
Accurate?
Power Supply
Uninterruptible Power Supply[1]
Accurate?
Power
Uninterruptible Power Supply[1]
Accurate?

Wafer handling17

Chuck Table moving in X- and Y- direction[1]
Accurate?
Wafer size
Integrated Wafer Cleaning System with Atomizing Nozzle[1]
Accurate?
12" Porous Chuck Table & Spinner Table[1]
Accurate?
8" Porous Chuck Table & Spinner Table[1]
Accurate?
Cassette Loading / Unloading[1]
Accurate?
Supported wafer size
2" to 12"[1]
Accurate?
Wafer cleaning system
Integrated with Atomizing Nozzle[1]
Accurate?
Wafer size
2" to 12"[1]
Accurate?
Wafer cleaning system
Integrated Wafer Cleaning System with Atomizing Nozzle[1]
Accurate?
Chuck table
Chuck Table moving in X- and Y-direction; 12" and 8" Porous Chuck Table & Spinner Table[1]
Accurate?
Loading/unloading
Cassette Loading / Unloading[1]
Accurate?
Chuck Table Movement
X and Y direction[1]
Accurate?
Chuck Table Sizes
12" and 8" Porous Chuck Table & Spinner Table[1]
Accurate?
Cassette Handling
Cassette Loading / Unloading[1]
Accurate?
Chuck table motion
Chuck Table moving in X- and Y-direction[1]
Accurate?
Chuck table and spinner table
12" Porous Chuck Table & Spinner Table[1]
Accurate?
Chuck table and spinner table
8" Porous Chuck Table & Spinner Table[1]
Accurate?

Optics & imaging12

Type FX Laser Head[1]
Accurate?
BSS-6 Optics System[1]
Accurate?
High Resolution Image Processing System with Auto Focus[1]
Accurate?
Laser head
Type FX[1]
Accurate?
Optics system
BSS-6[1]
Accurate?
Category
Laser Saw[1]
Accurate?
Laser head
Type FX Laser Head[1]
Accurate?
Optics system
BSS-6 Optics System[1]
Accurate?
Vision system
High Resolution Image Processing System with Auto Focus[1]
Accurate?
Laser Head Type
Type FX[1]
Accurate?
Image Processing
High Resolution Image Processing System with Auto Focus[1]
Accurate?
Equipment type
Laser Saw[1]
Accurate?

Performance4

Y-axis positioning accuracy
0.003 mm within 310 mm[5]
Accurate?
Y-axis positioning accuracy
0.003 mm or less / 310[5]
Accurate?
Y-Axis Positioning Accuracy
0.003 mm or less per 310 mm[5]
Accurate?
Y-axis positioning accuracy
0.003 以內/310[5]
Accurate?

Control & software4

Graphical User Interface with Touch Screen[1]
Accurate?
SECS/GEM Software[1]
Accurate?
Virus-free PC[1]
Accurate?
User interface
Graphical User Interface with Touch Screen[1]
Accurate?

Dimensions & facilities5

Dimensions (W x D x H)
1,210 x 3,270 x 1,906 mm[5]
Accurate?
Weight
approx 2,570 kg[5]
Accurate?
Dimensions (WxDxH)
1,210 x 3,270 x 1,906 mm[5]
Accurate?
Dimensions
1,210 x 3,270 x 1,906 mm[5]
Accurate?
Weight
約 2,570 kg[5]
Accurate?

Configuration & options29

Fully Automatic Frame Handling System[1]
Accurate?
Independent Hogomax spin coating system[1]
Accurate?
Duct Unit (Internal Type)[1]
Accurate?
Overseas Transformer Unit[1]
Accurate?
Operation & Troubleshooting Manual (English)[1]
Accurate?
Installation and 3-days Operation Training[1]
Accurate?
Options:[1]
Accurate?
Intemal lighting[1]
Accurate?
Max workpiece size
ø300 mm[5]
Accurate?
Processing mode
Fully automatic[5]
Accurate?
X-axis feed speed range
0.1 - 1,000 mm/s[5]
Accurate?
OEM
Disco[1]
Accurate?
Model
DFL 7361[1]
Accurate?
Maximum workpiece size
ø300 mm[5]
Accurate?
Processing method
Fully automatic[5]
Accurate?
Frame handling
Fully Automatic Frame Handling System[1]
Accurate?
Coating system
Independent Hogomax spin coating system[1]
Accurate?
Duct unit
Duct Unit (Internal Type)[1]
Accurate?
Documentation
Operation & Troubleshooting Manual (English); Installation and 3-days Operation Training[1]
Accurate?
Ablation processing support
Supports ablation processing; corresponding to 300mm workpiece[5]
Accurate?
Spin Coating System
Independent Hogomax spin coating system[1]
Accurate?
Duct Unit
Internal Type[1]
Accurate?
Transformer
Overseas Transformer Unit[1]
Accurate?
X-Axis Feed Speed
0.1 - 1,000 mm/s[5]
Accurate?
Transformer unit
Overseas Transformer Unit[1]
Accurate?
Documentation
Operation & Troubleshooting Manual (English)[1]
Accurate?
Training
Installation and 3-days Operation Training[1]
Accurate?
Maximum workpiece size
ø300[5]
Accurate?
Processing mode
全自動[5]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
SECS/GEM Software——Listed as an option.Equipment inventory listing[1]
Intemal lighting——Listed as an option.Equipment inventory listing[1]
Virus-free PC——Listed as an option.Equipment inventory listing[1]
STM DFL7161 2021 SW unified——Listed as an option.Equipment inventory listing[1]
Barcode reading function for auto recipe loading——Listed as an option.Equipment inventory listing[1]
Compatibility with Hogomax 5L tanks——Listed as an option.Equipment inventory listing[1]
Change of Laser Focus Position for Maintenance——Listed as an option.Equipment inventory listing[1]
Additional Kerf check sequence——Listed as an option.Equipment inventory listing[1]
Password Modification up to Level 4——Listed as an option.Equipment inventory listing[1]
Disco CO2 Injector + Integration specs——Listed as an option.Equipment inventory listing[1]
CO2 injector (stand-alone) added——Listed as an option.Equipment inventory listing[1]
Addition of drain valve for CO 2 injector specific resistance value stabilization——Listed as an option.Equipment inventory listing[1]
CO2 water target resistivity value Settable in device data——Listed as an option.Equipment inventory listing[1]
CO2 bubbler support (RS232C)——Listed as an option.Equipment inventory listing[1]
New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)——Listed as an option.Equipment inventory listing[1]
DFL7360——Different dimensions (1,715 x 3,265 x 1,998 mm) and weight (approx 2,770 kg); X-axis feed speed 1.0 - 1,000 mm/sweb.archive.org[5]
DFL7360FH——Different dimensions (1,100 x 2,100 x 1,990 mm) and weight (approx 2,090 kg)web.archive.org[5]
DFL7341——Corresponding to 200mm workpiece; maximum workpiece size ø200web.archive.org[5]
DFL7340——Corresponding to 200mm workpiece; maximum workpiece size ø200web.archive.org[5]
DFL7161——Mentioned as DFL7161 model with related specifications and in options text as target of some upgradesEquipment inventory listing[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationUninterruptible Power Supply[1]
  • Power conditioningOverseas Transformer Unit; Uninterruptible Power Supply[1]
  • Power SupplyUninterruptible Power Supply[1]
  • PowerUninterruptible Power Supply[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What optics and motion elements are specified for the DFL 7361?

The Disco DFL 7361 is specified with a Type FX laser head, a BSS-6 optics system, and a chuck table moving in the X and Y directions.[1][2][6]

Not publicly documented

The following facts about the DFL 7361 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7361 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the DFL 7361 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DFL 7361 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DFL 7361 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the DFL 7361 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (6)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]web.archive.org — disco.co.jp (Jul 3, 2015)web.archive.org
  6. [6]Equipment inventory listing
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Last updated Oct 15, 2026.

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