Comparison ledger
Disco 3220, Disco Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | DicingDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco Dicing |
| Cited variants | — |
|
| Specifications | ||
| equipment type | dicing saw[2] | — |
| Workplace size | ø150 mm[3] | — |
| Spindle layout | Single[3] | — |
| Spindle output | 1.5 kW at 30,000 min-1[3] | — |
| Spindle max revolution speed | 40,000 min-1[3] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[3] | — |
| Y-axis index step | 0.0001 mm[3] | — |
| Z-axis repeating accuracy | 0.001 mm[3] | — |
| Z-axis max blade size | ø58 mm[3] | — |
| Configuration | — | Parts Tool[4] |
| Substrate size | — | up to 8 inches[5] |
| Substrate thickness | — | up to 1.25 mm[5] |
| Spindle | — | 2” front-mount, air driven DC brushless, closed-loop control[5] |
| Y-axis | — | closed-loop linear encoder[5] |
| Height sensing | — | non-contact optical[5] |
| Pattern recognition | — | auto-focusing and programmable illumination[5] |
| Equipment type | — | Dicing saw[4] |
| Model | — | -[4] |
| Maximum substrate thickness | — | up to 1.25 mm[5] |
| Applications | — | dicing of silicon, bonded Si wafers, and all types of glasses[5] |
| Tool type | — | Dicing saw[5] |
| Cutting range | — | 160 mm x 162 mm[1] |
| Max substrate size | — | 6” wafers or 6″ x 6″ substrates[1] |
| Cutting blade thickness | — | 100 – 400 micron[1] |
| Positioning accuracy | — | < 0.005/160[1] |
| Spindle power/speed | — | 1.5 kW spindle at 30,000 per minute[1] |
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