Disco
Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco dicing saw is a semiconductor dicing tool capable of handling up to 8 inch substrates. The Disco dicing saw uses a 2” front-mount spindle with closed-loop control and a pattern recognition system for auto-focusing.[1]
What it is
General reference — not yet source-verifiedA dicing saw is semiconductor assembly equipment used to cut individual die apart from a processed wafer or other microelectronic substrate. Dicing equipment typically cuts along the unused lanes between devices, often called streets.
How it works
The DISCO dicing saw at Cornell is capable of handling substrates up to 8 inch and thickness up to 1.25 mm. The DISCO dicing saw at Cornell has a front-mount spindle, an air-driven DC brushless motor with closed-loop control, a closed-loop Y-axis linear encoder, non-contact optical height sensing, and a pattern recognition system with auto-focusing and programmable illumination. The DISCO dicing saw at Cornell is optimized for simple and tight-tolerance products up to 8 inch by 8 inch.[1]
Where it fits in the process flow
Semiconductor dicing equipment is used to cut apart individual die on a wafer. Dicing equipment is an essential step in the semiconductor manufacturing process.[4]
Applications
The DISCO dicing saw at Cornell has been used for dicing silicon, bonded Si wafers, and all types of glasses. The Cornell tool does not allow GaAs substrates.[1]
What do the numbers mean?
Power & electrical1
Wafer handling6
Optics & imaging2
Performance1
Control & software1
Configuration & options7
- Parts Tool[2]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DAD3220 | — | — | Automatic dicing saw with auto-alignment, auto-focus, auto-kerf check, 4 cutting channels with 320 degree max rotating angle, cutting blades thickness 100-400 micron, max substrate size 6” wafers or 6”x6” substrates, 160mm x 162mm cutting range, <0.005/160 positioning accuracy, 1.5 kW spindle at 30,000 per minute. | ece.utoronto.ca[3] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Spindle power/speed1.5 kW spindle at 30,000 per minute[3]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Flyer for dicing saw and tape applicatorDocumenttamu.edu
- Standard Operating Procedure for Disco Dicing Saw and Tape ApplicatorSOPtamu.edu
- ManualManualuic.edu
- CNS Consolidated RatesDocumentharvard.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does semiconductor dicing equipment do?
Semiconductor dicing equipment is used to cut apart individual die on a wafer. A dicing saw typically cuts along the unused section between dice called the street.[4]
What substrate size and thickness can the DISCO dicing saw at Cornell handle?
The DISCO dicing saw at Cornell is capable of handling substrates up to 8 inch with a thickness of up to 1.25 mm.[1]
How is dicing tape used in wafer dicing?
Dicing tape is a backing tape used during wafer dicing or other microelectronic substrate separation. The tape holds the pieces of the substrate together during the cutting process by mounting them to a thin metal frame, and the dies are removed from the tape later in the process.[5]
Not publicly documented
The following facts about the Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Dicing are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (19)Every fact above is drawn from these public sources
- [1]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
- [2]inventory listing
- [3]ece.utoronto.ca — ece.utoronto.caece.utoronto.ca
- [4]Semiconductor Dicing Equipment — chiphistory.orgchiphistory.org
- [5]Dicing tape - Wikipedia — en.wikipedia.orgen.wikipedia.org
- [6]Dicing - Wikipedia — en.wikipedia.orgen.wikipedia.org
- [7]Packaging Lab | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
- [8]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
- [9]Equipment Page | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
- [10]Nanoscribe Photonics GT2 high-resolution 3D printer - AggieFab Nanofabrication Facility — aggiefab.tamu.eduaggiefab.tamu.edu
- [11]MNTC - Equipment and Facilities | Service Centers — louisville.edulouisville.edu
- [12]Disco Automatic Dicing Saw | Nanotechnology Core Facility | University of Illinois Chicago — ncf.uic.eduncf.uic.edu
- [13]Disco 321 Wafer Dicing Saw — tmi.utexas.edutmi.utexas.edu
- [14]Disco DFL7340 Stealth Dicer - Equipment - nanoFAB Confluence — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [15]Bonding & Packaging — nanolab.berkeley.edunanolab.berkeley.edu
- [16]Dicing Saw | Shared Materials Instrumentation Facility — smif.pratt.duke.edusmif.pratt.duke.edu
- [17]CNS Consolidated Rates — cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
- [18]Packaging & Assemby — tudelft.nltudelft.nl
- [19]DBG・封装元件基板的分割 - DISCO Corporation — disco.co.jp (Feb 22, 2020)web.archive.org
Last updated Oct 20, 2026.
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