Disco
Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedDisco dicing equipment is a wafer singulation machine used to cut individual die apart after microfabrication. In semiconductor production, the cut is typically made along the narrow streets between devices so that finished chips can be separated from the parent wafer.
How it works
A dicing saw uses a rotating blade to separate a wafer into individual dies. The wafer is held on dicing tape or another support layer during cutting so that the die remain in place while the cut is completed, and then the pieces are removed later in the manufacturing flow.[2]
Where it fits in the process flow
General reference — not yet source-verifiedDicing sits near the end of wafer fabrication, after front-end processing and before die pick, package assembly, or other downstream handling. It is a singulation step that converts a processed wafer into separate chips for later assembly or testing flows.
Applications
General reference — not yet source-verifiedDicing equipment is used for semiconductor wafer singulation and for separating other microelectronic substrates. The same basic class of tool is also used for materials such as glass in some process environments.
What do the numbers mean?
Configuration & options1
- Parts Tool[1]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Flyer for dicing saw and tape applicatorDocumenttamu.edu
- Standard Operating Procedure for Disco Dicing Saw and Tape ApplicatorSOPtamu.edu
- ManualManualuic.edu
- CNS Consolidated RatesDocumentharvard.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How is dicing tape used in the singulation process?
Dicing tape supports the wafer or substrate during cutting, holding the die together during the dicing step and allowing the separated pieces to be removed later.[2]
Not publicly documented
The following facts about the Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Dicing are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (18)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]Dicing tape - Wikipedia — en.wikipedia.orgen.wikipedia.org
- [3]Dicing - Wikipedia — en.wikipedia.orgen.wikipedia.org
- [4]Dicing Saw - DISCO | CNF Users — cnfusers.cornell.educnfusers.cornell.edu
- [5]Equipment Capabilities - Electrical & Computer Engineering — ece.utoronto.caece.utoronto.ca
- [6]Packaging Lab | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
- [7]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
- [8]Equipment Page | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
- [9]Nanoscribe Photonics GT2 high-resolution 3D printer - AggieFab Nanofabrication Facility — aggiefab.tamu.eduaggiefab.tamu.edu
- [10]MNTC - Equipment and Facilities | Service Centers — louisville.edulouisville.edu
- [11]Disco Automatic Dicing Saw | Nanotechnology Core Facility | University of Illinois Chicago — ncf.uic.eduncf.uic.edu
- [12]Disco 321 Wafer Dicing Saw — tmi.utexas.edutmi.utexas.edu
- [13]Disco DFL7340 Stealth Dicer - Equipment - nanoFAB Confluence — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [14]Bonding & Packaging — nanolab.berkeley.edunanolab.berkeley.edu
- [15]Dicing Saw | Shared Materials Instrumentation Facility — smif.pratt.duke.edusmif.pratt.duke.edu
- [16]CNS Consolidated Rates — cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
- [17]Packaging & Assemby — tudelft.nltudelft.nl
- [18]DBG・封装元件基板的分割 - DISCO Corporation — disco.co.jp (Feb 22, 2020)web.archive.org
Last updated Jul 29, 2026.
