Waferpedia

Comparison ledger

3220 versus R07

Disco 3220 and Disco R07, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
R07Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeup to Φ8”
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco 3220Disco R07
Cited variants
  • R07-SDC600-BB101-75[1]
  • R07-SD400-BB200-75[1]
  • R07-SDC400-BB300-75[1]
  • R07-SDC400-BB500-75[1]
Specifications
equipment typedicing saw[2]
Workplace sizeø150 mm[3]
Spindle layoutSingle[3]
Spindle output1.5 kW at 30,000 min-1[3]
Spindle max revolution speed40,000 min-1[3]
X-axis feed speed range0.1 – 500 mm/s[3]
Y-axis index step0.0001 mm[3]
Z-axis repeating accuracy0.001 mm[3]
Z-axis max blade sizeø58 mm[3]
ModelDAD3241[4]
Max. workpiece sizeΦ8”[4]
X-/Y-axis cutting range210 mm[4]
Cutting speed0.1-800 mm/s[4]
Index positioning accuracy0.002/210 mm[4]
Z-axis max. stroke32.2 mm[4]
Moving resolution0.000002 mm[4]
Repeatability accuracy0.001 mm[4]
Θ-axis max. rotating angle320°[4]
Rotation speed range6,000-60,000 rpm[4]
Spindle power1.8 kW[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]disco.co.jpdisco.co.jp
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]aggiefab.tamu.eduaggiefab.tamu.edu