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Disco

R07

Dicing & Grindingup to Φ8”Disco R07 family
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DiscoR07
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Wafer size

up to Φ8”

Power

1.8 kW[1]

Performance

0.002/210 mm[1]

Optics

0.000002 mm[1]

What is it?

The source describes a Disco Hi-Tec dicing saw identified as the DAD3241. It is a high-productivity automatic dicing saw with servo motors on all axes, a 1.8 kW spindle, built-in microscope, PC and touch-screen control, and support for large workpieces up to Φ8".

What can it run?

Process applications and technology nodes documented for this tool.

  • Dicing of silicon
  • Dicing of glass
  • Dicing of sapphire
  • Cutting difficult-to-cut materials from silicon to ceramics

What do the numbers mean?

Power & electrical1

Spindle power
1.8 kW[1]
Accurate?

Optics & imaging1

Moving resolution
0.000002 mm[1]
Accurate?

Performance2

Index positioning accuracy
0.002/210 mm[1]
Accurate?
Repeatability accuracy
0.001 mm[1]
Accurate?

Configuration & options7

Model
DAD3241[1]
Accurate?
Max. workpiece size
Φ8”[1]
Accurate?
X-/Y-axis cutting range
210 mm[1]
Accurate?
Cutting speed
0.1-800 mm/s[1]
Accurate?
Z-axis max. stroke
32.2 mm[1]
Accurate?
Θ-axis max. rotating angle
320°[1]
Accurate?
Rotation speed range
6,000-60,000 rpm[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
R07-SDC600-BB101-75New R07 blade used in a borosilicate glass cutting process with BB101 bond.disco.co.jp[2]
R07-SD400-BB200-75New R07 blade used in a quartz cutting process with BB200 bond.disco.co.jp[2]
R07-SDC400-BB300-75R07 blade used in an alumina ceramics cutting process with BB300 bond.disco.co.jp[2]
R07-SDC400-BB500-75R07 blade used in an alumina ceramics cutting process with BB500 bond.disco.co.jp[2]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Spindle power1.8 kW[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the R07 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the R07 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the R07 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the R07 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the R07 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the R07 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]aggiefab.tamu.eduaggiefab.tamu.eduaggiefab.tamu.edu
  2. [2]disco.co.jpdisco.co.jpdisco.co.jp
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Last updated Jul 29, 2026.

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