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Disco

R07

Dicing & Grindingup to Φ8”Disco R07 family
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DiscoR07
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Wafer size

up to Φ8”

Power

1.8 kW[1]

Performance

0.002/210 mm[1]

Optics

0.000002 mm[1]

What it is

General reference — not yet source-verified

A dicing blade is a precision cutting tool used on a dicing saw to separate substrates, wafers, or small workpieces into individual parts. Dicing tools of this class are part of singulation and precision cutting operations rather than deposition, lithography, or etch steps.

How it works

General reference — not yet source-verified

Dicing blades cut by rotating at high speed while the workpiece is fed through the cut path under coolant. Resin-bond blades in this class are commonly selected to balance cut quality, wear behavior, and suitability for brittle materials.

Where it fits in the process flow

General reference — not yet source-verified

Dicing is a back-end substrate separation step that follows patterning, deposition, etch, thinning, or bonding operations that define the devices on the workpiece. Dicing is performed before individual die handling, packaging, or assembly.

What can it run?

Process applications and technology nodes documented for this tool.

  • Dicing of silicon
  • Dicing of glass
  • Dicing of sapphire
  • Cutting difficult-to-cut materials from silicon to ceramics

What do the numbers mean?

Power & electrical1

Spindle power
1.8 kW[1]
Accurate?

Wafer handling1

Wafer size
up to Φ8”[1]
Accurate?

Optics & imaging1

Moving resolution
0.000002 mm[1]
Accurate?

Performance2

Index positioning accuracy
0.002/210 mm[1]
Accurate?
Repeatability accuracy
0.001 mm[1]
Accurate?

Configuration & options12

Model
DAD3241[1]
Accurate?
Max. workpiece size
Φ8”[1]
Accurate?
X-/Y-axis cutting range
210 mm[1]
Accurate?
Cutting speed
0.1-800 mm/s[1]
Accurate?
Z-axis max. stroke
32.2 mm[1]
Accurate?
Θ-axis max. rotating angle
320°[1]
Accurate?
Rotation speed range
6,000-60,000 rpm[1]
Accurate?
Type
Resin bond blades[2]
Accurate?
Applications
Glass, quartz, ceramics, etc.[2]
Accurate?
Major uses
Glass (borosilicate glass, non-alkali glass), crystal, ceramics, QFN, metal, quartz, alumina, LTCC, aluminum nitride[2]
Accurate?
Product type
Resin bond blades[2]
Accurate?
Bond types listed
BB101, BB106, BB200, BB300, BB500[2]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
R07-SDC600-BB101-75——New R07 blade used in a borosilicate glass cutting process with BB101 bond.disco.co.jp[2]
R07-SD400-BB200-75——New R07 blade used in a quartz cutting process with BB200 bond.disco.co.jp[2]
R07-SDC400-BB300-75——R07 blade used in an alumina ceramics cutting process with BB300 bond.disco.co.jp[2]
R07-SDC400-BB500-75——R07 blade used in an alumina ceramics cutting process with BB500 bond.disco.co.jp[2]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Spindle power1.8 kW[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What kind of blade is the Disco R07?

The Disco R07 is a resin bond dicing blade series.[2]

Not publicly documented

The following facts about the R07 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the R07 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the R07 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the R07 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the R07 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the R07 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]aggiefab.tamu.edu — aggiefab.tamu.eduaggiefab.tamu.edu
  2. [2]disco.co.jp — disco.co.jpdisco.co.jp
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Last updated Oct 20, 2026.

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