Waferpedia

Comparison ledger

DAD 3220 Automatic Dicing versus DFG 840 Automatic

Disco DAD 3220 Automatic Dicing and Disco DFG 840 Automatic, side by side. Every value shown is drawn from its cited encyclopedia entry.

LinkedIn X Email
Side-by-side comparison of selected equipment models
Attribute
DAD 3220 Automatic DicingDisco
DFG 840 AutomaticDisco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DADDisco DFG
Specifications
Spindle1.5 kw[1]—
Objective lens7.5 x[1]—
Configuration1000 Watt Spindle[2]50/60 Hz[5]
Phase—3 Phase[5]
DAD 3220 Automatic Dicing entryDFG 840 Automatic entry

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing