Disco
The Disco DAD 3220 is an automatic dicing saw for semiconductor wafer dicing. The Disco DAD 3220 features a spindle with power ratings of 1.5 kW and 1000 W and a maximum spindle speed of 40,000 min−1. The Disco DAD 3220 supports 6-inch wafers.[1][2][3][4]

A dicing saw is a singulation tool used in semiconductor and related microfabrication lines. Dicing saws cut processed wafers or substrates into individual dies along predefined streets after most front-end and back-end device fabrication is complete.
Automatic dicing saws generally hold a taped wafer or substrate on a chuck, align the cut pattern with an optical system, and move a rotating blade through programmed streets. The machine typically combines spindle motion, stage motion, alignment optics, and process monitoring to execute repeated cuts across the workpiece.
Dicing takes place late in device manufacturing after wafer fabrication and after any needed thinning, backside preparation, or protective mounting for singulation. The dicing step prepares individual chips or device pieces for downstream handling such as die attach, packaging, or further assembly.
Automatic dicing saws are used where a wafer or similar substrate must be separated into individual units with controlled kerf placement. Typical application areas include semiconductor devices, compound semiconductor parts, sensors, optoelectronic devices, and other small substrates laid out in arrays.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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The following facts about the DAD 3220 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD 3220 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD 3220 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD 3220 Automatic Dicing are not on record.
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No publicly documented failure modes or field errata for the DAD 3220 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD 3220 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 20, 2026.
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