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DAD 3220 Automatic Dicing versus KR15

Disco DAD 3220 Automatic Dicing and Disco KR15, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
DAD 3220 Automatic DicingDisco
KR15Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—8"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DADDisco KR15
Cited variants—
  • KR15-A/KR15-B[1]
Specifications
Spindle1.5 kw[2]—
Objective lens7.5 x[2]—
Configuration1000 Watt Spindle[3]—
Blade designation—Disco KR15[6]
Blade thickness—200 micron[6]
Blade grit—low grit[6]
Intended materials—sapphire, glass, and silicon[6]
Max. workpiece size—Φ8"[6]
Thickness—200 micron[6]
Grit—Low grit[6]
DAD 3220 Automatic Dicing entryKR15 entry

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Sources (6)Every fact above is drawn from these public sources
  1. [1]thk.comthk.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]aggiefab.tamu.eduaggiefab.tamu.edu