Comparison ledger
Disco DAD3220 and Disco DAD3221, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3220Disco | DAD3221Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3220 | Disco DAD3221 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | DAD3220[1] | — |
| Code | SAW3[1] | — |
| Location | Sample Prep Room[1] | — |
| Type | — | automatic dicing saw[2] |
| Wafer size | — | 100, 150 mm wafers[2] |
| Setup | — | non-contact setup[2] |
| Blade monitoring | — | blade breakage detector[2] |
| Cutting functions | — | circle cut for edge trimming or down sizing[2] |
| Particle/ESD mitigation | — | CO2 injector to prevent particle adhesion and electrostatic discharge damage[2] |
| Alignment aids | — | pattern recognition system; automatic micro-alignment[2] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →