Disco
DAD3220
The Disco DAD3220 is an automatic dicing saw. The Disco DAD3220 is designed for 6-inch workpieces. The Disco DAD3220 has a single spindle.[1][2][3]
Plate 01DISCO DAD3220 Touch Panel Replacement
VICPAS TOUCHWatch on YouTubePlate 02Dicing saw. Disco DAD 3220. Blade Replacement.
Oleksandr DobroliubovWatch on YouTube
What it is
The Disco DAD3220 is an automatic dicing saw. The Disco DAD3220 is a single-axis dicing saw with a single spindle. The Disco DAD3220 is designed for compactness and is compatible with workpieces up to Φ6 inch, including 150 × 150 mm workpieces under a user-specified specification. The Disco DAD3220 has been discontinued, and the successor equipment is the DAD3221.[2][3]
How it works
The Disco DAD3220 includes an LCD touch panel with a graphical user interface. The Disco DAD3220 includes auto-alignment, auto-focus, and auto-kerf check functions. The Disco DAD3220 uses a 1.5 kW spindle with a shaft lock function for blade changing. The Disco DAD3220 offers an optional reduced-expansion spindle made with expansion-resistant materials for greater processing precision.[2][3]
The Disco DAD3220 has an X-axis cutting range of 160 mm and an X-axis cutting speed range of 0.1 to 500 mm/s. The Disco DAD3220 has a Y-axis cutting range of 162 mm, an index step of 0.0001 mm, and index positioning accuracy of 0.005/160 mm single error and 0.003/5 mm. The Disco DAD3220 has a Z-axis maximum stroke of 32.2 mm with Φ2 inch blades, a moving resolution of 0.00005 mm, and repeatability accuracy of 0.001 mm. The Disco DAD3220 has a θ-axis maximum rotating angle of 320 degrees. The Disco DAD3220 spindle has a rated torque of 0.48 N·m and a rotation speed range of 3,000 to 40,000 min−1.[2][3]
Where it fits in the process flow
General reference — not yet source-verifiedDicing fits near the end of device fabrication, after films, patterns, and structures have been created on the substrate. Dicing prepares individual chips, coupons, or test pieces for packaging, assembly, inspection, or further handling. Dicing is commonly used when a process flow needs separation of completed or partially completed devices from a larger wafer or panel.
Applications
The Shared Materials Instrumentation Facility uses the Disco DAD3220 for programmed dicing of silicon and other substrates.[1]
- Programmed dicing of silicon and other substrates
What do the numbers mean?
Power & electrical1
Wafer handling1
Optics & imaging1
Performance5
Control & software1
Dimensions & facilities4
Configuration & options23
What replaced it?
Related models
- siblingDisco DAD641— Listed on the same equipment page under packaging equipment.source[5]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Spindle rated output1.5 kW[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DAD3220 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD3220 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAD3220 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAD3220 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAD3220 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAD3220 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (8)Every fact above is drawn from these public sources
- [1]smif.pratt.duke.edu — smif.pratt.duke.edusmif.pratt.duke.edu
- [2]disco.co.jp — disco.co.jpdisco.co.jp
- [3]DAD3220 | ダイシングソー | 製品情報 | 株式会社ディスコ — disco.co.jpdisco.co.jp
- [4]smif.pratt.duke.edu — smif.pratt.duke.edusmif.pratt.duke.edu
- [5]Equipment Page | Utah Nanofab — nanofab.utah.edunanofab.utah.edu
- [6]DICING SAW - DISCO DAD3220 — Columbia Nano Initiative — cni.columbia.educni.columbia.edu
- [7]http://tstvn.com/wp-content/uploads/2021/07/Brochure-DAD3220-_-Dicing-Saws-_-Product-Information-_-DISCO-Corporation.pdf — tstvn.comtstvn.com
- [8]DAD3220 | AUROTECH CORPORATION — aurotech.comaurotech.com
Last updated Oct 20, 2026.
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