Comparison ledger
Disco DAD3220 and Disco DTG 8460 Taiko, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3220Disco | DTG 8460 TaikoDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3220 | Disco DTG 8460 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | DAD3220[1] | — |
| Code | SAW3[1] | — |
| Location | Sample Prep Room[1] | — |
| Configuration | — | 3 Chucks[2] |
| Phase | — | 200-2008 V, 50 A, 50/60 Hz, 3 Phase[2] |
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