Comparison ledger
Disco DAD3220, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DAD3220Disco | 15Lapmaster |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3220 | Lapmaster 15 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | DAD3220[1] | — |
| Code | SAW3[1] | — |
| Location | Sample Prep Room[1] | — |
| Max workpiece size | φ6 inch / 150×150 mm (user-specified specification)[2] | — |
| X-axis cutting range | 160 mm[2] | — |
| Cutting speed | 0.1 - 500 mm/s[2] | — |
| Y-axis cutting range | 162 mm[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Y-axis positioning accuracy | 0.005/160 mm (single error), 0.003/5 mm[2] | — |
| Z-axis max stroke | 32.2 mm (with φ2 inch blades)[2] | — |
| Z-axis moving resolution | 0.00005 mm[2] | — |
| Z-axis repeatability accuracy | 0.001 mm[2] | — |
| θ-axis max rotating angle | 320 deg[2] | — |
| Spindle rated output | 1.5 kW[2] | — |
| Spindle rated torque | 0.48 N·m[2] | — |
| Spindle rotation speed range | 3,000 - 40,000 min⁻¹[2] | — |
| Equipment dimensions (W × D × H) | 500 × 900 × 1,670 mm[2] | — |
| Equipment weight | Approx. 550 kg[2] | — |
| Display | LCD touch panel with graphical user interface[2] | — |
| Standard functions | Auto-alignment, auto-focus, auto-kerf check[2] | — |
| Spindle lock | Shaft lock function for easier blade changing[2] | — |
| Type | Automatic dicing saw[2] | — |
| Workpiece size | 6-inch / 150 × 150 mm workpieces[2] | — |
| Workpiece note | Special specification for 6-inch square workpieces[2] | — |
| Spindle count | Single spindle[2] | — |
| Equipment width | 500 mm[2] | — |
| Equipment dimensions | 500 × 900 × 1,670 mm[2] | — |
| Functions | Auto-alignment, auto-focus, and auto-kerf check[2] | — |
| Single spindle | Yes[2] | — |
| Index step | 0.0001 mm[2] | — |
| Index positioning accuracy | 0.005/160 mm (single error); 0.003/5 mm[2] | — |
| Z-axis max. stroke | 32.2 mm (Φ2 inch blades)[2] | — |
| Rotation speed range | 3,000 - 40,000 min⁻1[2] | — |
| Application | Programmed dicing of silicon and other substrates[3] | — |
| Input Power | — | 110 Vac[4] |
| Plate Diameter | — | 15 inches (381 mm)[5] |
| Number of Conditioning Rings | — | 3[5] |
| Ring ID | — | 5.5 inches (140 mm)[5] |
| Standard RPM | — | 60[5] |
| RPM Range (Variable Speed Drive) | — | 0-60[5] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[5] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[5] |
| Length | — | 25 inches (635 mm)[5] |
| Width | — | 20 inches (508 mm)[5] |
| Height | — | 24 inches (610 mm)[5] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[5] |
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