Comparison ledger
Disco DAD3221 and Disco DAD641, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3221Disco | DAD641Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 150mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3221 | Disco DAD641 |
| Specifications | ||
| Type | automatic dicing saw[1] | — |
| Wafer size | 100, 150 mm wafers[1] | — |
| Setup | non-contact setup[1] | — |
| Blade monitoring | blade breakage detector[1] | — |
| Cutting functions | circle cut for edge trimming or down sizing[1] | — |
| Particle/ESD mitigation | CO2 injector to prevent particle adhesion and electrostatic discharge damage[1] | — |
| Alignment aids | pattern recognition system; automatic micro-alignment[1] | — |
| Tool type | — | Dicing saw[2] |
| Location | — | Backend Lab[2] |
| Tool name | — | Disco DAD641[3] |
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