Comparison ledger
Disco DAD3221 and Disco DFL 7560 L, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3221Disco | DFL 7560 LDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 150mm | Robot Wafer handling |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3221 | Disco DFL |
| Cited variants | — |
|
| Specifications | ||
| Type | automatic dicing saw[2] | — |
| Wafer size | 100, 150 mm wafers[2] | Robot Wafer handling[1] |
| Setup | non-contact setup[2] | — |
| Blade monitoring | blade breakage detector[2] | — |
| Cutting functions | circle cut for edge trimming or down sizing[2] | — |
| Particle/ESD mitigation | CO2 injector to prevent particle adhesion and electrostatic discharge damage[2] | — |
| Alignment aids | pattern recognition system; automatic micro-alignment[2] | — |
| Wafer | — | Can be modified at later date to 3”, 4” & 6” wafers and frame[1] |
| Configuration | — | Operation by touch panel LCD monitor[1] |
| Uninterruptible Power Supply | — | 1[1] |
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