Waferpedia

Disco

DFL 7560 L

DFL 7560 L — Inventory photo
Fig. 01DFL 7560 LInventory photo[1]

Wafer size

Robot Wafer handling

Power

1[1]

What is it?

The Disco DFL 7560 L is a laser saw with robot wafer handling, stated for 2-inch to 4-inch wafers.

What do the numbers mean?

Power & electrical4

Step-down Transformer 400 V, 3 phases, 50 Hz[1]
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Laser power supply with built in water cooled chillers[1]
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Chiller unit to supply cooling water for Laser power supply[1]
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Uninterruptible Power Supply
1[1]
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Wafer handling6

Wafer size
Robot Wafer handling[1]
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Wafer
Can be modified at later date to 3”, 4” & 6” wafers and frame[1]
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Wafer size
200mm Fully Automatic wafer handling from/to standard wafer cassette[1]
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Chuck for 200mm wafers[1]
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New robot design for handling heavier wafers[1]
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Wafer size
New CE marking 6 inch Lens and new Galvo Scanner Sapphire wafer deposited in stocker[1]
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Optics & imaging1

Low and High Magnification microscope with LED illumination[1]
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Performance1

Z axis positional repeatability 0.002mm Options: 1[1]
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Control & software1

X and Y axis with linear scale closed loop control[1]
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Dimensions & facilities1

Chiller unit to supply cooling water to X axis[1]
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Configuration & options6

Operation by touch panel LCD monitor[1]
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Signal tower[1]
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CE-marking[1]
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Operation and troubleshooting manuals[1]
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Machine modification includes:[1]
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Standard Accessories Include:[1]
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Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
200mm Fully Automatic wafer handling from/to standard wafer cassetteMachine modification includes 200mm fully automatic wafer handling from/to standard wafer cassette, chuck for 200mm wafers, new robot design for handling heavier wafers, new CE marking, 6 inch lens, and new Galvo Scanner.Equipment inventory listing[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationStep-down Transformer 400 V, 3 phases, 50 Hz[1]
  • ConfigurationLaser power supply with built in water cooled chillers[1]
  • ConfigurationChiller unit to supply cooling water for Laser power supply[1]
  • Uninterruptible Power Supply1[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the DFL 7560 L are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL 7560 L are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the DFL 7560 L are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DFL 7560 L are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DFL 7560 L is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the DFL 7560 L are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]激光切割机 | 7000系列 | 适用于烧蚀加工 - DISCO Corporationdisco.co.jp (Feb 22, 2020)web.archive.org
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Last updated Jul 29, 2026.

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