Comparison ledger
Disco DAD3241 and Disco DAG810, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3241Disco | DAG810Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | up to Φ8” | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3241 | Disco DAG810 |
| Specifications | ||
| Max. workpiece size | Φ8”[1] | — |
| X-/Y-axis cutting range | 210 mm[1] | — |
| Cutting speed | 0.1-800 mm/s[1] | — |
| Index positioning accuracy | 0.002/210 mm[1] | — |
| Z-axis max. stroke | 32.2 mm[1] | — |
| Moving resolution | 0.000002 mm[1] | — |
| Repeatability accuracy | 0.001 mm[1] | — |
| Θ-axis max. rotating angle | 320°[1] | — |
| Rotation speed range | 6,000-60,000 rpm[1] | — |
| Equipment type | — | compact, automatic grinder[2] |
| Materials | — | silicon, III/V materials (GaN, GaAs, InP), and various glass types (pure amorphous SiO2, float glass, pyrex)[2] |
| Wafer sizes supported by universal vacuum chuck table | — | 4", 5", 6", and 8"[2] |
| Mechanical frame use | — | for UV-tape mounted wafers or chips[2] |
| Spindle | — | high-rigidity, low-vibration spindle[2] |
| Grinding wheels | — | dedicated wheels for coarse and fine silicon grinding, coarse and fine glass grinding, and GaN fine grinding[2] |
| Probe-height | — | real-time probe-height from 4" wafer size[2] |
| User interface | — | LCD touch screen[2] |
| Grinding speed | — | as high as 30 microns/min[2] |
| Thickness variation | — | total thickness variation close to one micron[2] |
| Surface roughness | — | less than 100 nm[2] |
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