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Comparison ledger

DAD3241 versus DFL 7361

Disco DAD3241 and Disco DFL 7361, side by side. Every value shown is drawn from its cited encyclopedia entry.

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Side-by-side comparison of selected equipment models
Attribute
DAD3241Disco
DFL 7361Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeup to Φ8”Integrated Wafer Cleaning System with Atomizing Nozzle
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DAD3241Disco DFL
Cited variants—
  • SECS/GEM Software[1]
  • Intemal lighting[1]
  • Virus-free PC[1]
  • STM DFL7161 2021 SW unified[1]
  • Barcode reading function for auto recipe loading[1]
  • Compatibility with Hogomax 5L tanks[1]
  • Change of Laser Focus Position for Maintenance[1]
  • Additional Kerf check sequence[1]
  • Password Modification up to Level 4[1]
  • Disco CO2 Injector + Integration specs[1]
  • CO2 injector (stand-alone) added[1]
  • Addition of drain valve for CO 2 injector specific resistance value stabilization[1]
  • CO2 water target resistivity value Settable in device data[1]
  • CO2 bubbler support (RS232C)[1]
  • New version Zxis assembly for DFL7161 with higher rigidity specs (standard for STM)[1]
Specifications
Max. workpiece sizeΦ8”[2]—
X-/Y-axis cutting range210 mm[2]—
Cutting speed0.1-800 mm/s[2]—
Index positioning accuracy0.002/210 mm[2]—
Z-axis max. stroke32.2 mm[2]—
Moving resolution0.000002 mm[2]—
Repeatability accuracy0.001 mm[2]—
Θ-axis max. rotating angle320°[2]—
Rotation speed range6,000-60,000 rpm[2]—
Configuration—Type FX Laser Head[1]
Wafer size—Integrated Wafer Cleaning System with Atomizing Nozzle[1]
DAD3241 entryDFL 7361 entry

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu