Comparison ledger
Disco DAD3241 and Disco DFL 7560 L, side by side. Every value shown is drawn from its cited encyclopedia entry.
| Attribute | DAD3241Disco | DFL 7560 LDisco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | up to Φ8” | Robot Wafer handling |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD3241 | Disco DFL |
| Cited variants | — |
|
| Specifications | ||
| Max. workpiece size | Φ8”[2] | — |
| X-/Y-axis cutting range | 210 mm[2] | — |
| Cutting speed | 0.1-800 mm/s[2] | — |
| Index positioning accuracy | 0.002/210 mm[2] | — |
| Z-axis max. stroke | 32.2 mm[2] | — |
| Moving resolution | 0.000002 mm[2] | — |
| Repeatability accuracy | 0.001 mm[2] | — |
| Θ-axis max. rotating angle | 320°[2] | — |
| Rotation speed range | 6,000-60,000 rpm[2] | — |
| Wafer size | — | Robot Wafer handling[1] |
| Wafer | — | Can be modified at later date to 3”, 4” & 6” wafers and frame[1] |
| Configuration | — | Operation by touch panel LCD monitor[1] |
| Uninterruptible Power Supply | — | 1[1] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →