Waferpedia

Comparison ledger

DAD3241 versus DGP 8761 + DFM 2800 In-Line

Disco DAD3241 and Disco DGP 8761 + DFM 2800 In-Line, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
DAD3241Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeup to Φ8”
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DAD3241Disco DGP 8761
Specifications
Max. workpiece sizeΦ8”[1]
X-/Y-axis cutting range210 mm[1]
Cutting speed0.1-800 mm/s[1]
Index positioning accuracy0.002/210 mm[1]
Z-axis max. stroke32.2 mm[1]
Moving resolution0.000002 mm[1]
Repeatability accuracy0.001 mm[1]
Θ-axis max. rotating angle320°[1]
Rotation speed range6,000-60,000 rpm[1]
ConfigurationFully Automatic[2]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]aggiefab.tamu.eduaggiefab.tamu.edu
  2. [2]inventory listing