Waferpedia

Comparison ledger

DAD3241 versus R07

Disco DAD3241 and Disco R07, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
DAD3241Disco
R07Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeup to Φ8”up to Φ8”
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DAD3241Disco R07
Cited variants
  • R07-SDC600-BB101-75[1]
  • R07-SD400-BB200-75[1]
  • R07-SDC400-BB300-75[1]
  • R07-SDC400-BB500-75[1]
Specifications
Max. workpiece sizeΦ8”[2]Φ8”[2]
X-/Y-axis cutting range210 mm[2]210 mm[2]
Cutting speed0.1-800 mm/s[2]0.1-800 mm/s[2]
Index positioning accuracy0.002/210 mm[2]0.002/210 mm[2]
Z-axis max. stroke32.2 mm[2]32.2 mm[2]
Moving resolution0.000002 mm[2]0.000002 mm[2]
Repeatability accuracy0.001 mm[2]0.001 mm[2]
Θ-axis max. rotating angle320°[2]320°[2]
Rotation speed range6,000-60,000 rpm[2]6,000-60,000 rpm[2]
ModelDAD3241[2]
Spindle power1.8 kW[2]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]disco.co.jpdisco.co.jp
  2. [2]aggiefab.tamu.eduaggiefab.tamu.edu