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Comparison ledger

DAD3241 versus Z09

Disco DAD3241 and Disco Z09, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
DAD3241Disco
Z09Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer sizeup to Φ8”up to Φ8” workpieces
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DAD3241Disco Z09
Specifications
Max. workpiece sizeΦ8”[1]Φ8”[1]
X-/Y-axis cutting range210 mm[1]210 mm[1]
Cutting speed0.1-800 mm/s[1]0.1-800 mm/s[1]
Index positioning accuracy0.002/210 mm[1]0.002/210 mm[1]
Z-axis max. stroke32.2 mm[1]32.2 mm[1]
Moving resolution0.000002 mm[1]0.000002 mm[1]
Repeatability accuracy0.001 mm[1]0.001 mm[1]
Θ-axis max. rotating angle320°[1]320°[1]
Rotation speed range6,000-60,000 rpm[1]6,000-60,000 rpm[1]
ModelDAD3241[1]
Spindle power1.8 kW[1]
Control interfacePC and touch screen via a specialized interface system[1]
Built-in microscopeYes[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]aggiefab.tamu.eduaggiefab.tamu.edu