Waferpedia

Disco

Z09

DiscoZ09
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Wafer size

up to Φ8” workpieces

Power

1.8 kW[1]

Performance

0.002/210 mm[1]

Optics

0.000002 mm[1]

What is it?

The source describes a Disco DAD3241 automatic dicing saw with servo motors on all axes, a built-in microscope, PC and touch-screen control through a specialized interface system, and capability for difficult-to-cut materials from silicon to ceramics. It lists specifications including cutting range, speed, index accuracy, stroke, resolution, repeatability, rotation angle, and spindle speed range.

What can it run?

Process applications and technology nodes documented for this tool.

  • Dicing silicon
  • Dicing glass
  • Dicing sapphire
  • Dicing ceramics

What do the numbers mean?

Power & electrical1

Spindle power
1.8 kW[1]
Accurate?

Optics & imaging1

Moving resolution
0.000002 mm[1]
Accurate?

Performance2

Index positioning accuracy
0.002/210 mm[1]
Accurate?
Repeatability accuracy
0.001 mm[1]
Accurate?

Control & software1

Control interface
PC and touch screen via a specialized interface system[1]
Accurate?

Configuration & options8

Model
DAD3241[1]
Accurate?
Max. workpiece size
Φ8”[1]
Accurate?
X-/Y-axis cutting range
210 mm[1]
Accurate?
Cutting speed
0.1-800 mm/s[1]
Accurate?
Z-axis max. stroke
32.2 mm[1]
Accurate?
Θ-axis max. rotating angle
320°[1]
Accurate?
Rotation speed range
6,000-60,000 rpm[1]
Accurate?
Built-in microscope
Yes[1]
Accurate?
Interested in this tool?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Spindle power1.8 kW[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the Z09 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Z09 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Z09 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Z09 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Z09 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Z09 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]aggiefab.tamu.eduaggiefab.tamu.eduaggiefab.tamu.edu
  2. [2]Z09 | Dicing Blades | Product Information | DISCO CORPORATIONdisco.co.jpdisco.co.jp
  3. [3]Z09 | ダイシングブレード | 製品情報 | 株式会社ディスコdisco.co.jpdisco.co.jp
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Last updated Jul 29, 2026.

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