Waferpedia

Comparison ledger

DAD641 versus DFD 6240 Automatic Dicing

Disco DAD641 and Disco DFD 6240 Automatic Dicing, side by side. Every value shown is drawn from its cited encyclopedia entry.

Side-by-side comparison of selected equipment models
Attribute
DAD641Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size
Process node
Introduced
Production run
Lifecycle
Lifecycle milestones
Control system
Generation
FamilyDisco DAD641Disco DFD
Specifications
Tool typeDicing saw[1]
LocationBackend Lab[1]
Tool nameDisco DAD641[2]
ConfigurationSingle Spindle (1.2KW)[3]
Phase3 Phase[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing